microsemi page 1 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes description the um7500 series feat ures microsemi?s innovative passivated chip design which takes advantage of the latest silicon wafer bonding and junction passivation techniques. this new series of pin diodes incorporates all of the desirable rf properties of previ ous microsemi diodes plus extremely low leakages and very stable reverse characteristics. power dissipation capability is assured by microsemi?s metallurgically bonde d, fused in glass construction. this tec hnique continues to be the optimum approach for applications requiring reliable, high power diodes. low leakage distortion is achieved by maintaining high carrier lifetime and accurately controlling i-region thickness throughout the process. the um7500 series is designed for use in a broad range of rf and microwave switch and attenuator circuits. the packages make this series suitable for many high-en d medical applications such as mri and cat scan equipment. for military applications, the new series is capable of meeting all the requirements of mil-std-750 including htrb screening at 80% of rated voltage at 150 o c. important: for the most current data, consult microsemi ?s website: http://www.microsemi.com absolute maximum ratings at 25o c (unless otherwise specified) package condition pd a 25 o c pin temperature 10 w 15 o c/w b & e ? in. total length to 25 o c contact free air 5.5 w 27.5 o c/w 1.5 w c 25 o c stud temperature 10 w 15 o c/w d 25 o c stud temperature 7.5 w 20 o c/w sm 25 o c end cap temperature 7.5 w 20 o c/w all 1 us pulse (single) 35 kw operating and storage temperature range -65 o c to + 175 o c voltage ratings reverse voltage @ 0.5 ua 100v um7501 200v um7502 400v um7504 600v um7506 800v um7508 1000v um7510 1200v um7512 1400v um7514 key features ? voltage ratings to 1400 volt ? fully passivated pin chip ? low leakage, ir < 0.5 a ? void less, particle free construction ? hermetic fused in glass ? low loss, low distortion ? surface mount package available ? metallurgically bonded, thermally matched construction ? compatible with automatic insertion equipment applicati ons/benefits ? isolated stud package available ? surface mount package available ? rohs compliant packaging available: use umx7501b, etc. u u m m 7 7 5 5 0 0 0 0
microsemi page 2 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes style ?b? style ?sm? -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 if (a) -1 10 0 10 1 10 2 10 3 10 rs (ohms) um7500 typical f = 100 mhz electrical parameters @ 25 c (unless otherwise specified) parameter symbol conditions min. typical max. units total capacitance ct v r =100v, f= 1 mhz 0.8 1.0 pf series resistance r s if = 50 ma, f= 100 mhz 0.8 1.0 ohms parallel resistance rp v r = 100 v, f = 100 mhz 100k 150k ohms parallel resistance rp v r = 0 v, f = 100 mhz 10k 15k ohms carrier lifetime i f = 10 ma 2.5 3.5 s reverse current i r v r = voltage rating 0.1 0.5 a i-region width w - 100 m forward voltage v f i f = 50 ma 0.8 1.0 forward bias harmonic distortion (r2a/a,r3a/a) 100 mhz, p=30w, i f =50ma 80 90 dbc reverse bias harmonic distortion (r2a/a,r3a/a) 100 mhz, p=0dbm,v r =0v 60 70 dbc e e l l e e c c t t r r i i c c a a l l s s
microsemi page 3 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 vf (v) -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 if (a) um7500 typical 0 10 1 10 2 10 vr (v) 0 10 1 10 2 10 3 10 rp (kohms) um7500 typical 100 mhz 500 mhz 1 ghz e e l l e e c c t t r r i i c c a a l l s s
microsemi page 4 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes 0 25 50 75 100 125 150 175 stud temperature ( c) 0 1 2 3 4 5 6 7 8 9 10 11 12 pd max power dissipation (w) um7500 typical "c" package "d" package o e e l l e e c c t t r r i i c c a a l l s s
microsemi page 5 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes 0 10 1 10 2 10 3 10 pulse width (seconds) 0 10 1 10 2 10 pulse thermal impedance ( c/w) um7500 typical dc o 1 10 100 1000 vr (volts) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ct (pf) um7500 typical f = 1 mhz f = 100 mhz e e l l e e c c t t r r i i c c a a l l s s e e l l e e c c t t r r i i c c a a l l s s
microsemi page 6 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes style ?a? style ?b? style ?c? style ?cr?
microsemi page 7 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes style ?d? style ?dr? style ?e? style ?sm? m m e e c c h h a a n n i i c c l l
microsemi page 8 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes style ?sm? footprint notes: 1. these dimensions will match the term inals and provide for additional solder fillets at the outboard ends at least as wide as the terminals themselves , assuming accuracy of placement within 0.005? 2. if the mounting method chosen requires use of an adhesive separate from the solder compound, a round (or square) spot of cement as shown should be centrally located. m m e e c c h h a a n n i i c c a a l l
microsemi page 9 copyright ? 2005 rev. 0, 2005-11-03 www. microsemi . com um7500 power pin diodes notes: n n o o t t e e s s
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